Process for producing a patterned metal surface

ABSTRACT

A surface modification process which provides a means of rapidly heating a thin layer of a polymer surface or a thin coating of material on a coated substrate and various surfaces produced by such a process.

This is a division of application Ser. No. 07/665,694 field Mar. 7,1991, now U.S. Pat. No. 5,178,726.

BACKGROUND OF THE INVENTION

The idea of a large metal mass accelerator often called anelectromagnetic launcher (EML) was demonstrated in the late 1800's andutilized the repulsion between two current carrying loops. This type oflauncher is still used to illustrate the electromagnetic repulsionphenomena in basic physics classes today. The use of these EML's as gunswas shown around the turn of the century and consisted of multiple coilsolenoidal accelerators and laminated iron projectiles. Numerousattempts to produce large solid projectile guns with this method failedbecause of the difficulty of generating and switching the large amountsof power required.

Another class of known EML's used to accelerate projectiles is therailgun. This apparatus consists of two parallel conducting rails with asliding conductor. The projectile is placed perpendicular to, and incontact with, the rails. A current, passing from one rail through thesliding conductor and then through the second rail, generates a magneticfield which acts on the sliding conductor to push and accelerate italong the rails.

This apparatus requires high current levels and suffers from slidingconductor problems, as the metal to metal contact is not reliable andleads to severe arcing. The next advancement to the railgun was to use aplasma. This replaced the sliding metal contact and propelled theprojectile. Modern railgun research has been principally in this area.

A relatively recent improvement to the railgun is the coaxial plasmagun. Coaxial electrodes utilizing high energy capacitive discharges haveexisted since the early 1960's. Such devices, usually operated at areduced atmosphere, use a static gas prefill or a "puffed" gas as theworking material to generate the plasma. Energy, in for example acapacitor bank, is connected across the electrodes, causes the gas tobreakdown, and forms a highly ionized plasma which is accelerated downthe gun by the resulting Lorentz forces. Such electromagnetic plasmaaccelerators were intensively developed in the 1960's, principally fortwo applications: propulsion and nuclear fusion. The goal of this workwas to efficiently produce high velocity pulsed plasma. Prefill gassystems lead to dense plasma focus which is useful for fusionapplications. Puffed gas systems produce a directed slug of plasma andare useful in space thruster applications. Development has continued inthese areas with added applications for high power switches and as asource of x-rays, ions, and electrons.

A. Feugeas, et al, "Nitrogen Implantation of AISI 304 Stainless Steelwith a Coaxial Plasma Gun", J. Appl. Phys. 64, (5), September, 1988, p.2648, described such a coaxial plasma gun used as an ion implanter, andshowed that the resulting implanted stainless steel had better wearproperties than the untreated material.

M. Sokolowski, "Deposition of Wurtzite Type Boron Nitride Layers byReactive Pulse Plasma Crystallization," J. Crystal Growth, 46, 1979, p.136, describes a scientific study on the use of a coaxial plasmagenerator to crystallize thin layers of boron nitride.

Ion implantation has been used for some time to modify the surfaceproperties of various materials such as metals, polymers, and coatings.The use of directed energetic ion beams to improve adhesion, createtexture, enhance wear or scratch resistance, make polymers conductive,and increase optical transmission has been reported. Ion implantationhas not been used for improving adhesion by melting an underlyingsemicrystalline polymer. Ion implantation cross-links or degrades thepolymer without melting.

Other surface modification processes are well known. For example E-beam,corona and plasma treatment have been used to increase the adhesion ofcoatings to surfaces, etch material, and change the chemistry of thesurface. These methods, as well as ion implantation, are eithercontinuous or long pulse length processes, their low energy flux resultsin a low heat transfer rate, and as such they are not appropriate forsurface modification as exemplified by the present invention. Most ofthese treatments affect polymer surfaces in a fairly gross manner, andany thermal modification which takes place, affects the bulk of thepolymer and not just the surface. The process of the present inventionis an advance over these earlier processes of surface modificationbecause its short pulse length, high fluence, and high intensity allow athin surface treatment of a material and thus do not affect the bulkphysical or chemical properties of the material.

U.S. Pat. No. 4,822,451 (Ouderkirk et al) teaches a process for thesurface modification of semicrystalline polymers wherein said polymerscan have predetermined amounts of their surfaces renderedquasi-amorphous by irradiation with high energy pulses, such as forexample an excimer laser. This process essentially teaches energytransfer alone (the greatest particle mass being e-beam irradiation).

"Comparative Status of Pulsed Ion Implantation", J. Gyulai and I.Krafcsik, Nuclear Instruments and Methods in Physics Research B37/38(1989) pp 275-279 describes an experimental exploration of the effectsof pulsed ions on doping and annealing of materials. metals, ceramicsand organics are considered as targets for the pulsed ions. Generally atleast one thousand pulses were used and the study used primarily boronions. The work is primarily performed on metal surfaces andsemiconductive surfaces, although organic surfaces are generallydescribed.

SUMMARY OF THE INVENTION

The invention is a process for directing pulses of plasma or ions or ascanned beam of plasma or ions including a plasma of high intensity,high fluence ions and charged and neutral particles to impact a thinsurface layer of an object, to thus alter the chemistry, crystalmorphology, topography, or density of said surface layer, employingplasma generated from a gas, liquid, or solid source. This surfacemodification process provides a means of rapidly heating a thin layer ofpolymer surface or a thin coating on a substrate, and it utilizes apulsed ion or pulsed plasma source, one such source, never before usedin this type of process, is referred to as a coaxial plasma gun. Anotheraspect of the invention is the various surface modifications produced bysuch a process, and the process of ablating surfaces by the action ofsuch pulses.

DETAILED DESCRIPTION OF THE INVENTION

Pulses or directed (e.g., scanned) beams of plasma or high energy ionsmay be directed against various surfaces with a variety of beneficialeffects. The pulses may be used to ablate or etch various surfaces orwriting on surfaces. The pulses may be used to alter the chemistry orphysical properties of surfaces, particularly organic surfaces, and moreparticularly synthetic organic polymeric surfaces. The pulses may alterthe crystalline state of semicrystalline polymers and in some polymersmay crosslink a surface region of the polymer without the presence ofany crosslinking agents. The invention will be described with respect tothese and other effects of the pulse projecting processes describedherein.

A unique, thin, quasi-amorphous surface layer on a semi-crystallinepolymer was described in U.S. Pat. No. 4,879,176 (Ouderkirk et al.), andthe process for producing such a surface was described in U.S. Pat. No.4,822,451 (Ouderkirk et al.). This quasi-amorphous surface layer isformed by radiation of sufficient intensity and energy density and ofvery short time duration to cause rapid heating of only the surfacelayer of the polymer. The process of that invention does not teach orsuggest the use of coincident mass transfer and energy transfer toeffect the formation of the quasi-amorphous zones or areas.

The present invention is a process for treating or altering surfaces,and (on appropriate semicrystalline surfaces) for producing a similarquasi-amorphous surface layer and also for producing other surfacemodifications to polymers as well as to thin coatings of materials onvarious substrates. The process utilizes a plasma or ion directingdevice, especially preferred is a coaxial plasma gun (e.g., railgun) asa source of accelerated plasma generated from a gas, liquid or solidsource.

The process of the present invention, with proper control, can be usedto etch polymers (or materials on the surface of polymers), melt thesurface of polymers, produce the above mentioned quasi-amorphous surfaceon polymers, crosslink the surface of certain polymers (e.g., especiallypolyethylene terephthalate and fluorene polyester), add or modifychemistry at and to the surface of polymers, improve adhesion to thesurface of polymers, and etch applied coatings or layers from thesurface of polymers. It can also be used to sinter organic dispersioncoatings, crystallize inorganic coatings, and anneal inorganic coatingson various substrates. The process requires the projection of a plasmahaving a molecular weight of at least 1 (e.g., H) at the intendedsurface.

There are two necessary conditions required of the energy source toprovide the treatment of the present invention. Both high intensity(high power per unit area) and high energy density are required. Theserequirements assure that a substantial amount of heat generated in thevery thin surface of treatment in a very short time stays in the surfaceduring the short increments of the process, often referred to as apulse. The effect of these requirements is to concentrate energy intothe surface layer. Thermal diffusion, from the thin treatment layer intothe bulk, reduces this concentration of energy and makes the processless efficient. It is, therefore, required that only a small amount ofheat be dissipated into the bulk during treatment. The more heat that istransferred to the bulk during surface treatment, the less efficient theprocess becomes until so much heat goes into the bulk that the processno longer works. Because of this requirement, most non-pulsed or longpulse length energy sources such as flame treatment, low to moderateintensity ion implantation, conventional UV lights, corona treaters,sputtering and vapor deposition apparatus, and the like will not work.

High energy pulses of ions or plasmas can be produced by either magneticor electrostatic accelerators. within these categories, the followingdevices can be used as sources for surface thermal modification:

    ______________________________________                                        Electrostatic accelerators:                                                   Ion beam accelerators                                                         Magnetically insulated ion diodes                                             Magnetic accelerators:                                                        Coaxial plasma guns (railguns)                                                Magnetically assisted plasma shock generators.                                ______________________________________                                    

Ion Beam Accelerators

Ion beam accelerators consist of a plasma ion source, electrostaticaccelerating grids and plates, and beam focusing and scanning optics.Electrostatic accelerators are commonly used to produce low or moderateintensity ion beams, and hence are not normally useful for thermalsurface modification. Normal applications of ion beams are forintensity-linear processes such as ion implantation and doping, plusmoderate intensity processing such as annealing. The intensity of ionbeams can be increased by focusing and `ion bunching`. This technologyis being developed for nuclear fusion. It is believed that highintensity beams have never been publicly used in technical areasdescribed in the present invention.

High intensity pulsed or rapidly scanned ion beams can be used foramorphization, demetallization, and ablative etching. At least 10,000W/cm² is required for amorphization of 1 micrometer of semicrystallinepolymer. Ablative etching of coatings and polymers requires about 10times that power density (e.g., >10⁵ W/cm²). High intensity ion beamsmay be used for maskless imaging of polymers and coatings on polymersusing the conditions described in this invention.

Magnetically Insulated Ion Diodes

These are well developed devices for producing 50-1000 ns duration ionbeams with an ion energy of 50-500,000 kev. This is probably the bestalternative to the coaxial plasma gun.

An ion diode is a two electrode device, consisting of a plate and agrid. A plasma is created in the space between the electrodes, and theions are extracted and accelerated by a high voltage positive pulse thatis applied to the grid. A magnetic field is used near the plate to trapelectrons, increasing the relative amount of energy transferred to theions.

There is prior art in the use of ion diodes for ablative deposition (cf.Nuclear Instruments and Methods in Physics Research, "Comparative Statusof Pulsed Ion Implantation," J. Gyulai and I. Krafcsik, B37/38 (1989)pp. 275-79). No prior art has been found on applications relevant to theuse of ion diodes on polymer films or coatings on polymer films.

Electromagnetically Driven Shock Tubes

This category covers coaxial plasma guns, railguns, and a variety ofdevices usually used for generating plasma shock waves. The drivemechanism in all of these devices is mutual repulsion between magneticfields generated by current flow through the electrodes and the plasma.

The devices that will work for our applications are generally known as`T-tubes`, conical shock tubes and magnetically driven surface dischargedevices. Like the coaxial plasma gun, these accelerators will driveplasma to very high velocity.

The mechanism of use of these devices will be identical to the operationof the coaxial plasma gun in the present invention.

Coaxial Plasma Gun

Coaxial plasma guns and railguns are well described in the literaturesuch as:

Methods of Experimental Physics. Vol. 9 - Part A, 1970, Academic Press

--Descriptions of electromagnetically driven shock tubes.

"Nitrogen Implantation of AISI 304 Stainless Steel with a Coaxial PlasmaGun," J. N. Feugeas et al., J. Appl. Phys., Vol. 64 (5), Sep. 1, 1988,pp. 2648-2651

--Demonstrated ion implantation for improved hardness of steel.

"Deposition of Wurtzite Type BN Layers by Reactive Pulse PlasmaCrystallization," M. Sokolowski, J. of Crystal Growth, Vol. 46 (1979),pp. 136-138

--One of a series of papers by this group on growing crystalline thinfilms of diamond, BN, and Al₂ O₃ on substrates by either using theelectrodes as a source, gas phase chemistry, or modification of a thinfilm on a substrate.

Ion Diodes

"Comparative Status of Pulsed Ion Implantation" (i. Gyulai et al.,supra)

--Describes pulsed ion implantation, semiconductor annealing and doping,organic resist hardening, and producing conductive polymers. Theprocesses involved in resist hardening and increased conductivity arenot explained in much detail. The closest area to the present invention,resist hardening, required several hundred pulses, and thereforeinvolves much different conditions than the present process forcrosslinking.

"Preparation and Characteristics of ZnS Thin Films by Intense Pulsed IonBeam," Y. Shimotori et al., J. Appl. Phys. Vol. 63 (3), Feb. 1, 1988,pp. 968-970

--Demonstrated ablative deposition of ZnS films by ablating a ZnS targetwith pulsed ions. This has not been demonstrated by a coaxial gun.Deposition with a coaxial gun should be faster and less expensive.

The coaxial plasma gun is the instrument of choice in the presentinvention and is capable of producing the short pulse width, highintensity, high energy density required for this process. The effectivepulse width of the plasma should be in the range of 10 nanoseconds toeither 1 millisecond or 100 microseconds to assure rapid thermalexcitation of the affected surface layer. The efficiency of the processcan be increased by preheating the surface to be treated. The intensityof the plasma source should be over 1000 watts/cm², or better over100,000 watts/cm². The energy density of the plasma must be in the rangeof 1 mJ/cm² to 1,000 J/cm² with the lower energy densities achieved byincreasing the distance between the gun and the material to be treatedor by reducing the gun discharge energy.

An "effective pulse" can be generated by scanning with a focused beam.By controlling the dwell time of the beam on a given area, the effect ofthe beam may be the same as a pulse of the fluence range required in thepresent invention. Repeated effective pulses may be generated on an areaby repeated scanning of that area. For many treatments 1 to 5 effectivepulses are sufficient, 1 to 10 or 1 to 20 effective pulses may be neededin other treatments and for ablation, 1 to 500 or even 1 to 1000effective pulses may be necessary.

The coaxial plasma puff gun preferred in the practice of the presentinvention is conventional in both the electrical and mechanical layoutand similar to the one described in A. Feugeas, et al., "NitrogenImplantation of AISI 304 Stainless Steel with a Coaxial Plasma Gun," J.Appl. Phys. 64, (5), September, 1988, p. 2648. The power to the gun ofthis invention is provided from a bank of three parallel 33 uF, 10 kV,20 nH capacitors. These capacitors are connected to the breech of thegun with a parallel plate bus. The gun itself consists of a 1 inch (2.5cm) diameter copper rod in the center of a 2 inch (5.1 cm), 1/16 inch(0.159 cm) wall copper tube. The two electrodes have equal length of 6inches (15.24 cm). The gun acts as both the high voltage switch and theaccelerator. The process is initiated with a pulse of gas from anelectrically driven automotive fuel injector. The gas is provided with aback pressure to the valve of between 20 and 300 psi, and the valve isset to a pulse width of between 0.2 and 10 ms. The longer pulse width isrequired to initiate discharge at lower capacitor voltages. The gunoperates at a background pressure of less than 1 motor, typically 2×10⁻⁴Torr. Generally the pulsing apparation operates at less than 0.8 bar,less than 0.4 bar, and often less than 0.05 bar. The gas pulse isradially distributed by a PTFE disk behind a flange supporting the outerelectrode, fills the gap between the two electrodes at the breech of thegun, is ionized by the high field between the electrodes, and begins todischarge the capacitor. The current flowing from the capacitor throughthe electrodes and the plasma, electromagnetically accelerates theplasma down the barrel formed by the coaxial electrodes. The nominal 1microsecond duration, 500-1000 J of energy, plasma pulse, leaves the gunat a velocity of about 100,000 m/s, spreads out in an approximate 30°cone with a near Gaussian radial energy profile, and strikes the surfaceof the material being treated. The plasma transfers energy to thesurface, quickly raising the surface temperature, and initiates a rangeof effects depending on its intensity and energy density. This plasmacan originate from solid, liquid, or gaseous material and may be eitherinert or chemically reactive, depending on the material used to startthe plasma discharge as described above. When the accelerated plasmastrikes a material, the surface simultaneously experiences hightemperatures (>10000 K) and pressures (>10 atmospheres) for severalmicroseconds. This process creates unique structural and or chemicalchanges in the exposed surface.

The normal application of the coaxial plasma gun for the processesdescribed in this invention requires operation in a vacuum at a pressureof less than 10⁻² torr. If the capacitor is electronically switched ortriggered, then pressures up to 600 torr (about 0.8 bar) may be used.

The use of a coaxial plasma gun to treat polymeric surfaces can producea variety of effects depending on process parameters such as theparticular polymer being treated, the energy of the impinging plasma,the chemical reactivity of the plasma, and other physical or chemicalprocess conditions. The variation of conditions allows control over thedesired treatment. For example, polymeric surfaces can be etched away,selectively through a mask, by the use of a relatively large amount ofenergy in the plasma pulse. A lesser energy will melt a thick layer ofthe surface and cause the polymer to flow still lesser energy willcreate a quasi-amorphous thin layer. Various conditions can causecross-linking of certain polymeric surfaces, or add chemistry to thesurface.

Polymer etching is useful in various applications including multilayercircuit board production, imaging, forming features for light controlfilm and for priming polymer surfaces. Dry etching technology ispreferred in these applications because it is capable of producingstructures with a high aspect ratio and resolution and with fewerenvironmental concerns than wet chemical etching techniques.Additionally, wet chemical methods tend to have specific chemistries fordifferent polymers. Dry etching techniques are much less sensitive topolymer chemistry, and the same process can be applied to a wide rangeof polymers. In the past the greatest limitation of dry etching has beenprocess speed, particularly where large volumes of polymer must beetched. The present inventive process possesses the requirements thatmany industrial etching processes require; that is, both the capabilityof dry etching and high process speed. Clear images with resolutions ofless than 10⁻⁴ m (a line with a thickness of less than 10⁻⁴ m) may bereadily achieved.

It has been found that the rapid thermal processing of the presentinvention improves the adhesion of coatings to semicrystalline polymersby two mechanisms. The first is that the elimination of crystallinityallows a coating to diffuse into the surface. This effect is substantialin polymers with as little as 5% crystallinity. The second mechanism isthought to be most noticeable in oriented, highly crystalline polymerssuch as poly(ethylene terephthalate),(PET), and biaxially orientedpolypropylene (BOPP). The adhesion in these cases is higher because theamorphous surface is tougher than the oriented, semicrystalline polymer.The increased fracture resistance of the amorphous polymer can increasecoating adhesion by 5 to 20 times. There are two important features tomechanism two: 1) the semicrystalline polymer can be amorphized beforeor after the coating is applied, and 2) unlike most surfacemodifications for improved adhesion, mechanism two is sometimespartially reversible by thermal treatment.

The present inventive process can also be used to etch away appliedcoatings, selectively if desired. Thus metallic coatings on polymers canbe etched away using either a contacting or non-contacting mask, leavingdesirable patterns or printing.

The accelerated coaxial plasma gun can also be used to treat variouscoatings on any substrate. It is possible to sinter organic dispersioncoatings, crystallize inorganic coatings or anneal inorganic coatings bythe choice of proper process parameters on substrates of polymers,metals, inorganics or ceramics.

The process of the present invention is thus seen to be a versatile,useful tool for surface modification. Because of the short pulse, highintensity, and high fluence properties of the impinging plasma, heat isdelivered to the surface layer faster than heat diffuses into the bulkpolymer, leaving the bulk underlying material unaffected.

There are ranges of useful processes in which the present invention maybe used. One of the more useful processes involves the formation ofpatterned images of metal on polymer (or other surfaces). The patternedimages may be in the form of decoration or functional design (e.g.,circuitry). one process involves the use of the pulses of ions or plasmain an imagewise pattern against a surface comprising a carrier layer andover that a top coat of a metal or inorganic oxide layer on the top coatlayer is a predetermined pattern of an energy absorbing material (e.g.,ink, pigment loaded polymer, graphite, etc.). The surface is pulsed withsufficient intensity of ions or plasma to etch (ablate) the metal orinorganic oxide where there is no energy absorbing material present. Thepulsed ions or plasma should not be at such an intensity and duration,however, that both the energy absorbing material and the underlyingmetal or inorganic oxide is completely etched away. The treated surfacemay be in the form of films, sheets, fibers, particles or bulk articles.

The surface which is to be ablated or etched by the pulsed ions orpulsed plasma may comprise many different materials, both organic andinorganic. organic materials may be any solid organic such as natural orsynthetic polymeric material. Inorganic materials such as ceramics(e.g., SiO₂, TiO₂, etc.), glasses, metals, composites, layered materials(e.g., metal coated polymers, metal coated ceramics, polymer coatedceramics, etc.), and the like may be used in the practice of theinvention.

"Polymers", as used in the present invention, may include both inorganicor organic polymers. organic polymeric materials include, for example,polyesters (e.g., polyethyleneterephthalate), polyfluorene, polyimide,polyamides, polycarbonates, polyolefins, polyepoxides, polysiloxanes,polyethers, polyetherimides, polysulfones, polyurethanes, polyvinylresins (e.g., polyvinyl chloride, polyvinylidene chloride, polyvinylalcohol), fluorinated and/or chlorinated polymers (such aspolytetrafluoroethylene), polyvinyl acetals, and other film formingpolymers, both natural and synthetic polymers. Inorganic polymersinclude such materials as glasses and ceramics. Polymers, unlessotherwise restricted include both organic and inorganic polymers.

Where the substrate (carrier layer) is a semicrystalline polymer (orpolyimide, which displays some semicrystalline characteristics), asimilar product may be produced in a different way. The semicrystalline(or polyimide) polymeric substrate may be coated with a layer of metalor inorganic oxide. The coating may be done in any manner as by vapordeposition, sputtering, sol coating, etc. and will generally be at acoating thickness of 1 to 500 nm. The pulsing of ions or plasma in apatterned (imagewise) distribution against the coating layer (of metalor inorganic oxide). The energy and duration of the pulsing must beinsufficient to significantly ablate the coating. Preferably there is noablation at all. However, the energy and duration should be sufficientto create a quasi-amorphous state in the polymer beneath the pulsedareas of the coating (see U.S. Pat. Nos. 4,872,451; 4,868,006;4,879,176; and 4,902,378 for the definition and qualities of aquasi-amorphous polymer). The creation of the quasi-amorphous areasunder the coating changes the strength of adhesion of the coating withrespect to areas that have not been rendered quasi-amorphous. The weakerbond areas (where not pulsed) can be selectively stripped from thecarrier layer. In general, the effect of the pulsed ions or plasma onsemicrystalline materials, within the fluence ranges of the presentinvention, is to increase adherence to that surface.

A stripping type process can also be performed by first pulsing (withions or plasma) in a patterned fashion the surface of a semicrystallineor polyimide material (preferably a film, sheet or flat material). Thisproduces quasi-amorphous zones in the pulsed areas with semicrystallingmaterials and appears to produce a similar effect on polyimides. Themetal or inorganic oxide layer may then be deposited over the surface(preferably by a process of atomic or molecular deposition such as vapordeposition or sputtering). Again, the deposited material more stronglybonds to the quasi-amorphous areas. This relative bonding strength maychange by as little as a factor of 2.0 or as much as a factor of 12.0 ormore. The material deposited onto unpulsed areas may be more readilystripped from the surface (as by the use of an adhesive tape applied tothe coating). This leaves a pattern of the coating on the surface whichcorresponds to the pattern of the pulsing.

These processes leave discernible fingerprints in the final article thatcan be used to identify which type of process was used to form the finalarticle. Where the pulsed ions or plasma was used to ablate areas of thecoating (metal or metal oxide) from a semicrystalline or polyimidecarrier layer, quasi-amorphous zones can be found in the areas free ofthe coating but not in areas where the coating remains in a pattern.This condition exists immediately after the process of forming thearticle. If the article is subsequently heated or annealed, thequasi-amorphous areas will revert to their semicrystalline state.

If the article is formed by patterned pulsing of the semicrystallinesurface, before or after application of the coating, and then subsequentstripping of the coating from non-pulsed areas, the quasi-amorphousregions will be under the coating, but not in the coating free areas.Again, the quasi-amorphous zones can be converted to semicrystallinematerial by heating or annealing.

Generally, the effects of pulsed ions and plasma within the controlledfluence range of the present invention, can have unique effects uponpolyester (e.g., polyethylene terephthalate) and polyfluorene polyestersubstrates. In addition to formation of quasi-amorphous zones, thepulsed ions and plasma form crosslinked regions on the surface of thepolymer. The crosslinking can occur over a depth of less than 100 nm,usually only to a depth of 5 to 50 nm, with the quasi-amorphous zoneextending from 100 to 1000 nm in depth. This surface zonecharacterization for the polyester and polyfluorene polyester materialsis unique and can provide improved abrasion resistance.

EXAMPLES

The majority of examples to follow exemplify using the puffedaccelerated coaxial plasma gun with stationary samples. However, it willbe recognized by those skilled in the art that the accelerated plasmapulses can be used to treat continuous lengths of material byadvancement of the material through a targeted area as shown in Example62. The accelerated coaxial plasma gun would be operated in a repeatpulse mode while the sample to be treated would be moved eitherstep-wise or continuously into the path of the plasma pulses. The timingof the system would be varied such that any area of sample receives oneor more pulses. Processing speeds of 400 feet/minute (130 m/minute) orgreater can be obtained by pulsing the plasma at rates of only 10 timesper second. Wide widths could be treated using a gun of largerdimensions or multiple guns in parallel.

The following test procedures were used in all of the examples unlessotherwise specified.

Plasma power measurement: The front of a Gentec ED-550 pyroelectriccalorimeter was masked to a 0.23 cm² aperture using razor blades. Thispower meter was placed at the center line of the travel path of theplasma, 79 cm from the muzzle of the gun. The energy of the plasmaaccelerator's 100 uF capacitor was changed by the charge voltage. Energymeasurements averaged over 10 pulses were 0.55, 0.67, 0.78, 0.90 and1.02 J/cm² at capacitor voltages of 5, 5.5, 6, 6.5, and 7 kV,respectively. This calibration curve was then used to calculate theplasma energy striking the samples being treated.

Film thickness: Thickness measurements were made with an Ono Sokki Co.Ltd. (Japan) model EG-225 gauge.

EXAMPLES OF POLYMER ETCHING Example 1

A three mil (0.076 mm) thick stainless steel stencil having 2 to 4 mmwide openings was placed in contact with a 7×17 cm sample of 54micrometer thick skived polytetrafluoroethylene (PTFE) film. The filmwas exposed through the stencil to 500 pulses of plasma (0.2 pulses persecond) at an energy density of 1.1 J/cm² /pulse. 25±4 micrometers ofthe PTFE was etched in the open areas of the stencil. This demonstratesthat PTFE can be etched with the pulsed plasma to generate reliefstructures.

Example 2

The linearity of the rate of etching as a function of the number ofplasma pulses was measured for PTFE. Using the same plasma conditionsand polymer film as described in Example 1, three 7.5×40 cm sections offilm were-exposed to an increasing number of pulses. The etch depth wasmeasured to be 6, 14, and 27 micrometers for 100, 250, and 500 pulsesrespectively. From this result, the etching rate is constant at 54 nmper pulse.

Example 3

The rate of etching was measured as a function of plasma energy. Thesamples and conditions were the same as described in Example 2, only 500pulses were used and the plasma energy was varied. The etching rate at0.7, 0.93, and 1.1 J/cm² was 22, 40, and 60 nanometers per pulse,respectively. Hence, the etching rate increases disproportionately athigher energy densities.

Example 4

Using the polymer film and plasma conditions described in Example 1,holes were plasma etched into PTFE. A sample of PTFE was vapor coatedwith 50 nm of Cu as a conductive layer. An Archer™ resist decal, number276-1577 with 5 mil (0.13 mm) diameter holes was applied to the film,and the laminate was exposed to 1000 pulses of plasma. The decal wasremoved with solvent, and SEM's were taken of the structure. A 5 mil(0.13 mm) diameter hole was produced in the film by the exposure to theplasma. The wall of the hole was smooth and appeared free of anystructure due to the etching process itself.

Example 5

A sample of 1/2 inch (1.27 cm) wide 3M brand 92 polyimide tape wasexposed on the polyimide side to accelerated plasma pulses under thesame conditions as described in Example 1. 10 micrometers of theoriginal 46 micrometer total thickness of the polyimide was etched bythe process. The polyimide was covered with a loosely bound layer ofcarbon. This demonstrates that accelerated plasma can effectively etchpolyimide to form relief structures or vias in thin film.

EXAMPLES OF POLYMER MELTING Example 6

A sample of 110 micrometer thick porous nylon film, Polyamide 6 ID fromAkzo Corp., with average pore size of 0.1 micron, was exposed to 1 pulseof argon plasma at an energy density of 1.37 J/cm² /pulse. SEMmicrographs showed the surface pores of the film to be partially closedto a depth of 1 micron.

Example 7

A sample of 127 micrometer thick unoriented porous polypropylene film,made according to U.S. Pat. No. 4,726,989, with average pore size ofless than 0.1 micron, was exposed to 1 pulse of argon plasma at anenergy density of 1.37 J/cm² /pulse. SEM micrographs showed the surfacepores of the film closed to a depth of 0.75 to 1.0 microns.

Example 8

A sample of 125 micrometer thick unoriented porous polyethylene film,made according to U.S. Pat. No. 4,539,256, with average pore size ofless than 0.1 micron, was exposed to 1 pulse of argon plasma at anenergy density of 1.37 J/cm² /pulse. SEM micrographs showed the surfacepores of the film closed to a depth of 1.5 microns.

EXAMPLES OF CREATING QUASI-AMORPHOUS SURFACES Example 9

4 mil (0.102 mm) thick biaxially oriented PET with no slip agents from3M Co. was exposed to one accelerated argon plasma pulse, at an energydensity of 0.16 J/cm² /pulse. The reflectivity of this film as well asan untreated PET film was measured, using an integrating sphere opticalconfiguration, with a Lambda 9 spectrophotometer from Perkin Elmer overthe wavelength range of 300-1000 nm. These measurements showed that abroad decrease in reflectivity occurred on accelerated plasma exposureof the PET which is indicative of an outermost layer of aquasi-amorphous material.

Example 10

4 mil (0.102 mm) thick biaxially oriented PET film as used in Example 9was exposed to 1 accelerated helium plasma pulse at an energy density of0.55 J/cm² /pulse. The reflectivity of this sample exhibitedinterference fringes in the region 300-1000 nm. From the spacing of theinterference fringes the thickness of the amorphous layer produced onaccelerated plasma exposure was estimated to be 800-900 nm. Thisaccelerated plasma treated PET was also examined by ATR spectroscopy(KRS-5 reflection element at 45 degrees angle of incidence) in thewavelength region 6250-7692 nm. From the decrease in peak absorbance ofthe crystalline absorption band of PET at 7463 nm the thickness of theamorphous layer produced by accelerated plasma exposure was calculatedto be 835 nm. In both estimates of the amorphous film thickness therefractive index of the amorphous layer produced by accelerated plasmatreatment was assumed to be 1.55.

Example 11

Extrusion cast PET from 3m resin ER662000 was dissolved ino-chlorophenol and spin coated on a 75 mm diameter polished siliconwafer metallized with 100 nm of e-beam evaporated gold. The cast PETfilm was thermally crystallized in vacuum at 175° C. for 2 hours. Aftercrystallization the film had a thickness of 71 nm. The PET film was thenexposed to 1 accelerated argon plasma pulse with an energy density of0.42 J/cm² /pulse. Depth profiling of this film by IR spectroscopyindicated that the top 33 nm of this film had been amorphized by thisexposure. The IR depth profiling procedure is described in U.S. Pat. No.4,822,451 (Ouderkirk et al.). Samples of this accelerated plasma treatedPET thin film were then exposed to chloroform vapor and examined by IRreflection absorption spectroscopy (also described in U.S. Pat. No.4,822,451). An absorption band at 13175 nm in these IR spectra indicatedthe presence of chloroform trapped in the accelerated plasma amorphizedlayer on the surface of the PET film. Although the chloroform slowlydiffused out of the treated PET at room temperature, IR spectraindicated that 27% of the chloroform remained in the thin film 1140hours after initial exposure, thus showing the barrier properties of thetreated film.

Example 12

PET film number OR478400 from 3m Co. was dissolved in o-chlorophenol andspin coated on a 75 mm diameter polished silicon wafer, thus producingan amorphous PET sample. This sample was then exposed through astainless steel template to 1 accelerated argon plasma pulse with anenergy density of 2.0 J/cm² /pulse. The treated areas developed a darkblue image of the template. The sample was then dipped in methylenechloride to dissolve the amorphous PET, and the template pattern showedup clearly, confirming the accelerated plasma pulse converted theamorphous PET into a crosslinked structure which was insoluble in thesolvent.

EXAMPLES OF IMPROVED COATING ADHESION Example 13

4 mil (0.102 mm) thick biaxially oriented PET film as used in Example 9was exposed to 1 accelerated argon plasma pulse at an energy density of0.42 J/cm² /pulse. The treated film was then metallized with an 80 nmthick electron beam evaporated silver film. The effect of theaccelerated plasma amorphization on the PET prior to metallization onadhesion was determined by performing a number of 180° peel tests onuntreated and accelerated plasma treated areas of the metallized PET.The peel tests were done at a peel rate of 6 inches/min (13.2 cm/minute)using an Instrumentors, Inc. Model SP 101A slip/peel tester with 1 inch(2.54 cm) wide strips of Kapton™ tape attached to the metallized filmsamples. The tape used for these measurements was coated with athermoplastic polyamide adhesive (Union Camp Uni-rez™ 2645). Inattaching the tape to the metallized PET the samples were exposed totemperatures in the range of 70°-900° C. for 5-10 seconds. The averagepeel force required to remove the Ag from the untreated PET was 70 g/in.(27.6 g/cm). The average peel force measured during the testing of theaccelerated plasma treated areas was 602 g/in. (237 g/cm). In addition,the metal could not be removed from the accelerated plasma treated areasby the testing procedure used here. This indicates at least an 8.6 timesincrease in Ag film adhesion due to the presence of the acceleratedplasma amorphized PET film on the surface.

Example 14

5 mil (0.127 mm) thick polytetrafluoroethylene film was exposed to 1accelerated argon plasma pulse at an energy density of 0.15 J/cm²/pulse. An 80 nm thick Al film was then electron beam evaporated on thetreated polymer film. The effect of the accelerated plasma exposureprior to metallization on the Al adhesion was determined by peeling 1inch (2.54 cm) wide strips of the metallized polymer off of Number 966DS4 pressure sensitive adhesive from 3M Co. that had been transferred tostrips of 10 mil (0.254 mm) thick aluminum sheet. The average peel forcerequired to remove the Al from untreated areas of the film was 412 g/in.(162 g/cm). In the accelerated plasma treated areas the average peelforce increased to 911 g/in. (359 g/cm) and the Al was only incompletelyremoved from the teflon indicating that the Al adhesion had increased byat least a factor of 2.2 times.

Example 15

2 mil (0.051 mm) thick biaxially oriented polypropylene film (BOPP)number TX-200-2-C from Trea Industries was exposed to 1 acceleratedargon plasma pulse at an energy density of 0.42 J/cm² /pulse. An 80 nmthick Al film was then electron beam evaporated on the treated polymerfilm. The effect of the accelerated plasma exposure prior tometallization on the Al adhesion was determined as in Example 14. In theuntreated areas of the AL/BOPP, the average peel force required toremove the Al was 641 g/in. (252 g/cm). The average peel force increasedto 1621 g/in. (638 g/cm) in the treated areas. Again the Al was onlyincompletely removed by the peel testing in the accelerated plasmatreated areas indicating an increase in Al adhesion by a factor of atleast 2.5 times.

Example 16

4 mil (0.1 mm) thick biaxially oriented PET was exposed to 1 acceleratedhelium plasma pulse with an energy density of 0.55 J/cm² /pulse. 100 nmthick Al films were then electron beam evaporated on treated anduntreated PET films. The effect of the accelerated plasma exposure priorto metallization on the Al adhesion was determined as in Example 13. Inthe untreated areas the average peel force required to remove the Alfrom the polymer was 37 g/in. (14.6 g/cm). In the accelerated plasmatreated areas the average peel force increased to 132 g/in. (52 g/cm)and the Al was not removed from the polymer indicating that the Aladhesion had increased by at least a factor of 3.6 times on acceleratedplasma treatment of the PET.

Examples 17-21

2 mil (0.051 mm) thick BOPP was metallized with a 100 nm thick film ofelectron beam evaporated Al. Pieces of this Al metallized BOPP were thenexposed to accelerated argon plasma pulses over a range of plasmaenergies. The effect of this accelerated plasma treatment on the Aladhesion was determined as in Example 14. The results are listed inTable 1.

                  TABLE 1                                                         ______________________________________                                                 Plasma Energy  Peel Strength                                         Example  (J/cm.sup.2)   (g/in)     (g/cm)                                     ______________________________________                                        17       0.0              417       164                                       18       0.1              378       149                                       19       0.3            >1739      >685                                       20       0.6            >1728      >680                                       21       0.8            >1535      >604                                       ______________________________________                                    

For all samples exposed to plasma pulses with an energy density equal toor greater than 0.3 J/cm², the Al could not be removed from the BOPPwith the peel test procedure used here, indicating that the peelstrengths listed above are only lower limits for the actual values.

Example 22

4 mil (0.102 mm) thick polytetrafluoroethylene film was exposed to 2pulses of accelerated argon plasma with an energy density of 0.085 J/cm²/pulse. The effect of the accelerated plasma treatment on the adhesionof pressure sensitive adhesives to the surface was evaluated by 180°peel tests. 1 inch (2.54 cm) wide strips of a high tack adhesive tapenumber 622 from 3M Co. were peeled from treated and untreated areas ofthe film. The treated samples had an average peel force of 2221 g/in.(874 g/cm), while untreated samples had an average peel force of 213g/in. (84 g/cm) resulting in a ten fold increase in adhesion properties.

EXAMPLES OF ETCHING OF APPLIED COATINGS

Various polymer samples with nonmetal oxide and metal thin film coatingswere surface treated by exposure to accelerated plasma pulses. Theplasma pulses were fired at the sample target located 79 centimetersdownstream. The energy density incident on the sample surface was variedfrom 73 to 980 mJ/cm² per pulse with a pulse to pulse reproducibility of±12%. The process was operated at pressures of 0.15 motor or less andused He (90 psi) as the process gas.

Removal of the thin film coating, without extensive damage to theunderlying substrate, was observed on samples receiving plasma pulses atan energy flux equal to or greater than a critical threshold. Thisthreshold varied depending upon the coating material and thickness aswell as substrate type.

Selective thin film removal can be done by masking the sample from theplasma pulse using either a noncontact method such as a stencil or thedirect contact application of a thin coating to the sample surface. Allsamples were masked with a thin (approximately 1/16 inch [1.59 mm] wide)felt-tip marker line drawn vertically down the center of the samplearea.

The effect of the accelerated plasma pulse to image by selective thinfilm removal was measured by line resolution. Resolution was defined asbeing the thin film border remaining adjacent to the marker line drawnon the samples. The width of this border was measured using an opticalmicroscope at 450X with a 2.75 micron per division reticule. Thesevalues have a relative error of ±20%. The samples all showed the bestresolution values at the highest energy used for treatment. Thismeasurement of resolution is an lower limit since the ink line was notperfectly sharp.

Examples 23-27

Cu films were electron beam evaporated to thicknesses of 38, 76, 114,190 and 380 nm on 4 mil (0.102 mm) thick biaxially oriented PET film (3MCo.). Samples of each Cu thickness were treated by exposure to 1accelerated helium plasma pulse at each of the following energydensities (73, 172, 325, 450, 570, 640, 820, 930, and 980 mJ/cm²). Thethreshold for Cu removal occurred at an energy density of 325 mJ/cm² forthe three thinnest Cu films and at 640 mJ/cm² for the 190 and 380 nmfilms. The best imaging was observed at the highest energy densitytested, 980 mJ/cm², Wit h resolutions varying from 41 microns on the 38nm Cu film to 127 microns on the 380 nm film. The results are shown inTable 2.

                  TABLE 2                                                         ______________________________________                                                       Metal Etching Results                                                   Copper      Threshold   Highest                                               Thickness   Energy Density                                                                            Resolution                                   Example  (nm)        (mJ/cm.sup.2)                                                                             (microns)                                    ______________________________________                                        23        38         325         41                                           24        76         325         48                                           25       114         325         55                                           26       190         640         72                                           27       380         640         127                                          ______________________________________                                    

Experimental observation suggested that the mechanism for metal etchingby accelerated pulsed plasma treatment was partially a result ofdelamination between the substrate and its thin film layer. Therefore,copper etching was studied on various polymer films which were known tohave differing adhesion to copper. The substrates included a range ofcommodity polymers commonly vapor or sputter coated.

Examples 28-32

Cu films were electron beam evaporated on 2 mil (0.051 mm) thickbiaxially oriented polypropylene film (BOPP) as in Example 16, to thesame thicknesses and received the same treatment as Examples 23 to 27.As predicted by qualitative adhesion comparisons, copper was etched atlower energy densities on BOPP than on PET. All samples exhibited lowerthreshold and improved resolution values at equivalent Cu thicknesses.The results are shown in Table 3.

                  TABLE 3                                                         ______________________________________                                                   Threshold                                                                             Metal Etching Results                                             Copper    Energy    Maximum   Highest                                         Thickness Density   Energy Density                                                                          Resolution                               Example                                                                              (nm)      (mJ/cm.sup.2)                                                                           (mJ/cm.sup.2)                                                                           (microns)                                ______________________________________                                        28      38       172       930        8                                       29      76       325       930       22                                       30     114       325       820       22                                       31     190       450       980       41                                       32     380       570       980       77                                       ______________________________________                                    

Examples 33-37

Pieces of 2 mil (0.054 mm) thick low density polyethylene (LDPE) numberSF-30 from Consolidated Thermoplastics Co., Arlington Heights, Il., weredeposited with thin films of electron beam evaporated Cu. The samplesreceived the same coating thicknesses and treatment as Examples 23-27.This system exhibited image resolution values similar to those ofExamples 28-32 (CU/BOPP) despite significantly higher threshold valuesfor metal etching. The threshold values measured were comparable tothose for copper on PET. The highest resolution was obtained at anenergy density greater than this threshold and was at 980 mJ/cm² inthese examples. Table 4 lists the measured values along with theirassociated Cu thicknesses.

                  TABLE 4                                                         ______________________________________                                                       Metal Etching Results                                                   Copper      Threshold   Highest                                               Thickness   Energy Density                                                                            Resolution                                   Example  (nm)        (mJ/cm.sup.2)                                                                             (microns)                                    ______________________________________                                        33        38         325         11                                           34        76         325         14                                           35       114         325         19                                           36       190         325         28                                           37       380         570         63                                           ______________________________________                                    

Examples 38-42

A series of copper metallized polyimide films were treated to include asystem with high metal/polymer adhesion properties relative to theprevious examples and to demonstrate etching on a thermoset substrate.Similarly to Examples 23-27, Cu films were electron beam evaporated on 2mil (0.054 mm) thick PI film (pyromellitic dianhydride/oxydianiline). Aspredicted, CU/PI was the most difficult in the series to image. Thethreshold energy density required was almost double that of any othersystem. The highest resolution was obtained at an energy density greaterthan this threshold and was at 980 mJ/cm² in these examples. Inaddition, imaging to within a specification of <100 microns was limitedto thicknesses of 114 nm. These results are shown in Table 5.

                  TABLE 5                                                         ______________________________________                                                 Copper      Threshold   Highest                                               Thickness   Energy Density                                                                            Resolution                                   Example  (nm)        (mJ/cm.sup.2)                                                                             (microns)                                    ______________________________________                                        38        38         640         55                                           39        76         570         93                                           40       114         640         99                                           41       190         640         187                                          42       380         820         181                                          ______________________________________                                    

Examples 43-47

Ag, Al, Ni, Cr and SiO₂ thin films were electron beam evaporated to athickness of 80 nm on 4 mil (0.102 mm) thick biaxially oriented PET from3M Co. The samples were treated as previously described for Examples23-27. This was done to quantify the effect of differing thin filmtypes. The thickness of 80 nm was selected as being a typical depthrequiring metal etching. These samples can be compared to Example 24.

The inorganic SiO₂ was expected to have the lowest adhesion to PET andwas demonstrated to be the easiest system to image. The most difficultsystem was Cr/PET which required a threshold energy almost 3 timesgreater than the others studied and had the lowest resolution of themetals tested. The highest resolution was obtained at an energy densitygreater than this threshold and was at 980 mJ/cm² in these examples. Theresults for all five systems are summarized in Table 6.

                  TABLE 6                                                         ______________________________________                                                      Metal Etching Results                                                               Threshold   Highest                                                           Energy Density                                                                            Resolution                                    Example   Coating   (mJ/cm.sup.2)                                                                             (microns)                                     ______________________________________                                        43        Al        325         28                                            44        Ni        325         55                                            45        Cr        930         94                                            46        Ag        325         38                                            47        SiO.sub.2 325         19                                            ______________________________________                                    

Example 48

A 65-70 nm Ag film was electron beam evaporated on 7 mil (0.18 mm) thickPET film from 3m Co. The Ag film was then printed with Cavcure 2-ProcessBlack UV cure ink from Cavanagh Corporation, Flemington, N. J., toproduce a grid pattern of 30 micron lines with 10 mil (0.254 mm)center-to-center spacing. The sample was exposed to one argonaccelerated plasma pulse at an energy density of 1.4 J/cm². Theuntreated sample had a conductivity of 4.4 rehos per square measured byan LEI model 1010 Contactless Conductivity Probe from LehightonElectronics, Inc., of Lehighton, Pa., and a transmission of <1% at awavelength of 550 nm measured by a Lambda 9 UV/VIS/NIRSpectrophotometer, by Perkin Elmer Co. The imaged sample displayed a 1.5rehos per square conductivity but at a transmission of 52%. The lineresolution was measured to be 5 microns by optical microscopy techniquesas previously described.

Example 49

An Al thin film was electron beam evaporated to a thickness of 30-35 nmon 1.6 mil (0.041 mm) thick biaxially oriented polypropylene (BOPP) from3M Co. The Al film was then printed with Cavcure™ 2-Process Blue UVcurable ink in a 50% screen pattern with 125 lines per inch (49lines/cm) spacing. The sample was treated as in Example 48 but at anenergy density of 900 mJ/cm². The unmasked metal was removed by theexposure to the plasma pulse to reproduce an imaged metallic half-tone.

Example 50

50-100 nm thick aluminum was electron beam evaporated on a 3 mil (0.076mm) nonwoven substrate (3M Sasheen ribbon). The Al film was then printedon with a solvent based ink in a pattern containing, 0.25 mm minimumline widths and dot diameters. The sample was exposed to one acceleratedHe plasma pulse at an energy density of 3.3 J/cm². The treatmentselectively removed the non-ink covered Al coating reproducing theprinted image.

Examples 51-59

As previously mentioned, selective thin film removal can be done bymasking the sample from the plasma. All prior examples described the useof a surface coating. A sample can also be masked using the shadow of astencil. As previously described in Example 23, a sample was prepared bydepositing 38 nm of Cu on PET and then was treated with 1 acceleratedhelium plasma pulse through a 1 cm high by 2.54 cm wide aperture placed4-5 mm in front of the sample. Table 7 lists the area demetallized ateach of the treated energy densities.

                  TABLE 7                                                         ______________________________________                                                         Demetallized Dimensions                                               Energy Density                                                                              Width      Height                                      Example  (mJ/cm.sup.2) (mm)       (mm)                                        ______________________________________                                        51        73           --         --                                          52       172           --         --                                          53       325           23.5       7.75                                        54       450           23.75      9.25                                        55       570           23.75      9.0                                         56       640           23.75      9.0                                         57       820           24.5       9.25                                        58       930           24.75      9.75                                        59       *980          25.0       10.0                                        ______________________________________                                         *sample showed nearly squared corners (all others rounded)               

Example 60

30-35 nm of aluminum was electron beam evaporated on 1.6 mil (0.041 mm)thick biaxially oriented polypropylene (BOPP) from 3M Co. The Al sidewas then printed with Cavcure 2-Process Green Uv curable ink to producea pattern with 3 point numerals with 5 mil (0.127 mm) wide lines. Theprinted metallic film was subsequently vapor-coated with an additional100 nm of Al. The sample was exposed to one accelerated helium plasmapulse at an energy density of 520 mJ/cm². The Al remained on the areasthat were ink printed. The Al film that was deposited on the metallizedsurface was etched down through to the underlying polymer substrate.This demonstrates the ability to selectively remove thin films byaccelerated plasma treatment due to differences in surface adhesion.

Example 61

1.2 mil (0.03 mm) thick BOPP from 3M Co. was printed with Suncure #5process blue UV curable ink from GPI, to produce a pattern of 6 milcircular lines and spaces. The ink side was deposited with 100 nm ofelectron beam evaporated aluminum. The metallized film was then exposedto one accelerated argon plasma pulse at an energy density of 0.12J/cm². This treatment selectively removed the aluminum from the BOPPwhere there was no ink printing. This demonstrates the ability toselectively remove thin film coatings with accelerated plasma by varyingthe threshold energy for demetallization of the sample rather than byblocking the plasma with a mask.

Example 62

A 30-35 nm aluminum film was electron beam evaporated onto a continuous6 inch wide roll of 1.6 mil (0.041 mm) BOPP from 3M Co. The metallizedfilm was printed using Cavcure 2 process yellow UV curable ink toproduce a pattern of multiple line widths of 0.07 to 4 mm. The sampleroll was inserted in a web handling system in the vacuum chamber. Thedrive roll of the system was connected to a computer controlled Parkerseries 2100 Compumotor, which drove the web at a constant rate of 6.25ft/min (190 cm/minute) at a distance of 36 cm from the gun. The coaxialplasma gun was operated in a repeat pulse mode of 1.9 seconds/pulse andwas timed to treat the sample through a 6.3 cm high by 16.4 cm wideaperture with less than 0.3 cm overlap. Each pulse had an energy densityof 0.8 J/cm². A 6 meter length of material exposed to the acceleratedplasma pulses was shown to reproduce the printed pattern across theentire web, thus demonstrating the use of the coaxial plasma gun forcontinuous processing. This process is useful on any polymeric surface,whether semicrystalline or not. Polyimide substrates are particularlydesirably used in this process.

Example 63

65 micron average diameter glass beads with a 500 to 1000 A coating ofsilver were prepared according to standard wet silver platingtechniques. A layer of these beads were adhered to the surface of a PETfilm with 3M Shipping-Mate labeling adhesive. The bead layer was thenexposed to 1 pulse of accelerated argon plasma at an energy density of4.08 J/cm². The top half of the silver on the beads was etched off,leaving a very good retroreflector.

EXAMPLE OF SINTERING OF ORGANIC DISPERSIONS Example 64

A thin film of fluorinated ethylene propylene dispersion (DuPont FEP120) was coated on 4 mil (0.102 mm) thick biaxially oriented PET filmand was exposed to 1 accelerated helium plasma pulse with an energydensity of 0.32 J/cm² /pulse. SEM examination of untreated andaccelerated plasma treated areas of the teflon film showed that theaccelerated plasma had sintered the teflon particles (approximately100-150 nm diameter) into a smooth, continuous film (i.e., no detectableindividual particles after accelerated plasma exposure).

We claim:
 1. An article comprising a layer of semicrystalline polymerhaving a pattern of metal on at least one surface, the crystalline stateof said polymer under said metal layer being quasi-amorphous and thatquasi-amorphous state being different from the crystalline state of saidpolymer in areas which are not covered by said polymer.
 2. An articlecomprising a layer of semicrystalline polymer having a pattern of metalon at least one surface, the crystalline state of said polymer undersaid metal being different from the crystalline state of polymer whichis not under said metal, the crystalline state of polymer which is notunder said metal being quasi-amorphous.
 3. An article comprising a layerof semicrystalline polymer having a pattern of metal the crystallinestate of said polymer being quasi-amorphous either in areas not coveredby said metal or under said metal on at least one surface, thecrystalline state of said polymer being different under said metal thanin areas not covered by metal.
 4. The article of claim 3 wherein saidpattern comprises a grid.
 5. The article of claim 3 wherein thecrystalline state under said metal is the quasi-amorphous state.
 6. Thearticle of claim 3 wherein said metal comprises aluminum.
 7. The articleof claim 3 wherein said polymer comprises a polyolefin.
 8. The articleof claim 3 wherein said pattern of metal is in the form of circuitry. 9.The article of claim 3 wherein the crystalline state in said areas notcovered by metal is the quasi-amorphous state.
 10. The article of claim9 wherein said polymer comprises polyester.
 11. The article of claim 10wherein said polyester in said areas not covered by metal has a thincrosslinked layer of polyester over at least a part of saidquasi-amorphous area.
 12. The article of claim 10 wherein said metalcomprises aluminum.
 13. The article of claim 3 wherein said polymercomprises polycarbonate.
 14. The article of claim 13 wherein said metalcomprises aluminum.
 15. The article of claim 13 wherein said metalcomprises copper.